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Optical semiconductor inspection presents complex challenges, including the diminutive size of the target and proximity of individual dies in the wafer space. At the same time, the quality of wafer inspection results is critical due to the risks involved if requirements are not met. For these reasons, vision systems with exceptionally high speed and resolution capabilities can play an important role in semiconductor inspection. This paper addresses the challenges that can arise during the semiconductor inspection process, including reticle inspection in patterned and unpatterned wafers, the identification and flagging of deformed wires, and the presence and absence of features. It also explores the benefits of the Phantom S640 in maintaining uncompromised resolution and speed in optical machine vision inspection.